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| Definition | : | Flip Chip Bonding |
| Category | : | Academic & Science » Electronics |
| Country/ Region |
: | Worldwide
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| Popularity | : |
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| Type | : |
Initialism
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Flip Chip Bonding (FCB) is a semiconductor packaging technology used to connect Integrated Circuit (IC) to a substrate.
FCB involves the direct attachment of an IC chip to a substrate, such as a Printed Circuit Board (PCB), by flipping the chip upside down (hence the name flip chip) and bonding its electrical contacts to corresponding pads on the substrate.
The full form of FCB is Flip Chip Bonding
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